Solder bars are used as base and refill solders in a wide variety of alloys in wave and selective soldering
systems within the electronics industry. Stannol solders for electronics are manufactured exclusively from
first-melt metals or high-purity secondary raw materials. For this purpose, we only use tin with a purity
content of at least 99.9 percent.
| ALLOY NAME | ALLOY NUMBER² | ALLOY COMPOSITION | INTERNAL NAME | ROHS | MELTING POINT / MELTING RANGE (approximate values) |
|---|---|---|---|---|---|
| Sn99.9¹ | --- | Sn99.9 | ECOLOY T | lead-free | 232°C |
| S-Sn99.3Cu0.7² | 401 | Sn99.3Cu0.7 | ECOLOY TC | lead-free | 227°C |
| S-Sn97Cu3² | 402 | Sn97Cu3 | ECOLOY TC300 | lead-free | 227–310°C |
| S-Sn96.3Ag3.7² | 701 | Sn96.3Ag3.7 | ECOLOY TS | lead-free | 221°C |
| S-Sn95.5Ag3.8Cu0.7² | 713 | Sn95.5Ag3.8Cu0.7 | ECOLOY TSC | lead-free | 217°C |
| S-Sn96.5Ag3.0Cu0.5² | 711 | Sn96.5Ag3Cu0.5 | ECOLOY TSC305 | lead-free | 217–220°C |
| Sn97.1Ag2.6Cu0.3³ | --- | Sn97.1Ag2.6Cu0.3 | ECOLOY TSC263 | lead-free | 217–224°C |
| S-Sn99Cu0.7Ag0.3² | 501 | Sn99Cu0.7Ag0.3 | ECOLOY TSC0307 | lead-free | 217–227°C |
| S-Bi58Sn42² | 301 | Bi58Sn42 | ECOLOY TB | lead-free | 139°C |
| Bi57Sn42Ag1³ | --- | Bi57Sn42Ag1 | ECOLOY TBS | lead-free | 139–142°C |
| Flowtin Sn99.3Cu0.7â´ | --- | Sn99.3Cu0.7 + FLOWTIN | FLOWTIN TC | lead-free | 227°C |
| Flowtin Sn99.6Cu0.4â´ | --- | SN99.6Cu0.4 + FLOWTIN | FLOWTIN TC04 | lead-free | 227°C |
| Flowtin Sn97Cu3â´ | --- | Sn97Cu3 + FLOWTIN | FLOWTIN TC300 | lead-free | 227–310°C |
| Flowtin Sn96Ag4â´ | --- | Sn96Ag4 + FLOWTIN | FLOWTIN TS | lead-free | 221°C |
| Flowtin Sn95.5Ag3.8Cu0.7â´ | --- | Sn95.5Ag3.8Cu0.7 + FLOWTIN | FLOWTIN TSC | lead-free | 217°C |
| Flowtin Sn96.5Ag3.0Cu0.5â´ | --- | Sn96.5Ag3.0Cu0.5 + FLOWTIN | FLOWTIN TSC305 | lead-free | 217–220°C |
| Flowtin Sn97.1Ag2.6Cu0.3â´ | --- | Sn97.1Ag2.6Cu0.3 + FLOWTIN | FLOWTIN TSC263 | lead-free | 217–224°C |
| Flowtin Sn98.5Ag0.8Cu0.7â´ | --- | Sn98.5Ag0.8Cu0.7 + FLOWTIN | FLOWTIN TSC0807 | lead-free | 217–226°C |
| Flowtin Sn99Ag0.3Cu0.7â´ | --- | Sn99Ag0.3Cu0.7 + FLOWTIN | FLOWTIN TSC0307 | lead-free | 217–227°C |
| Flowtin + Sn99.3Cu0.7âµ | --- | Sn99.3Cu0.7 + FLOWTIN+ | FLOWTIN+ TC | lead-free | 227°C |
| TSCX0307³ | --- | Sn99Ag0.3Cu0.7+X | TSCX0307 | lead-free | 217–227°C |
| SN100Cⶠ| --- | Sn99.3Cu0.7NiGe | SN100C | lead-free | 227°C |
| SN100Ceⶠ| --- | Sn99.9NiGe | SN100Ce | lead-free | 227–232°C |
| SN100CSⶠ| --- | Sn99.3Cu0.7NiGe | SN100CS | lead-free | 227°C |
| SN100CeSⶠ| --- | Sn99.9NiGe | SN100CeS | lead-free | 227–232°C |
| **SN100CS+**ⶠ| --- | Sn99.3Cu0.7NiGe | SN100CS+ | lead-free | 227°C |
| **SN100CeS+**ⶠ| --- | Sn99.9NiGe | SN100CeS+ | lead-free | 227–232°C |
| S-Sn63Pb37E³ | 102³ | Sn63Pb37 | STANNOLY SN63 | lead-containing | 183°C |
| S-Sn63Pb37E³ | 102³ | Sn63Pb37 | STRATOLY SN63 | lead-containing | 183°C |
| Sn63Pb37³ | --- | Sn63Pb37P | WSL3 SN63 | lead-containing | 183°C |
| S-Sn62Pb36Ag2² | 171 | Sn62Pb36Ag2 | Sn62Ag2 | lead-containing | 179°C |
| S-Sn60Pb40² | 103 | Sn60Pb40 | Sn60 | lead-containing | 183–190°C |
| S-Pb93Sn5Ag2² | 191 | Pb93Sn5Ag2 | HMP (high melting point) | lead-containing | 296–301°C |
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In wave soldering, PCBs are soldered by passing them through a wave of solder. But whereas in reflow soldering, hot air is used to solder the electronic components on the board.
Wave soldering is ideal for soldering THT (Through Hole Technology) assembly. Besides, the process is affordable and can solder bulk PCBs in a short time. Hence, it is preferable for commercial soldering.
Wave soldering is not suitable for soldering surface-mounted components. Besides, other soldering techniques such as reflow soldering are preferred over the wave soldering technique. Hence, its use has decreased considerably in recent years.
When the temperature of the board increases suddenly, it will go into a thermal shock leading to its failure. To prevent this, the board undergoes a preheating process that raises its temperature gradually. Also most of thee fluxes get active at elevated temperatures hence preheating is important.
Yes, Drive Technologies is partnership company formed in Pune and have our corporate office in Pune, Maharashtra. Its operations are spread out all over India and EMIEA region.
