| FLUX | DIN EN ISO 9454-2 | J-STD-004 / J-STD-004C | APPLICATION METHOD* | VOC CONTENT | SOLID CONTENT % | APPLICATION | GREEN-CONNECT |
|---|---|---|---|---|---|---|---|
| EF160 Bio PV | 2.2.3.A | 0RL0 | S, D | High | 1.6 | Stringer, Wave, Selective | Y |
| EF180 Bio PV | 2.2.3.A | 0RL0 | S, D | High | 1.8 | Stringer, Wave, Selective | Y |
| EF200 Bio PV | 2.2.3.A | 0RL0 | S, D | High | 2.0 | Stringer, Wave, Selective | Y |
| X33-08i PV | 2.2.3.A | 0RL0 | S, D | High | 2.0 | Stringer, Wave, Selective | Y |
| EF200 | 2.2.3.A | 0RL0 | S | High | 2.0 | Wave, Selective | — |
| EF210 | 2.2.3.A | 0RL0 | S | High | 2.1 | Wave, Selective | — |
| EF250 | 2.2.3.A | 0RL0 | S | High | 2.5 | Wave, Selective | — |
| EF270 | 2.2.3.A | 0RL0 | S | High | 2.7 | Wave, Selective | — |
| EF270F | 2.2.3.A | 0RL0 | S, F | High | 2.7 | Wave, Selective | — |
| EF330 | 2.2.3.A | 0RL0 | S | High | 3.3 | Wave, Selective | — |
| EF350 | 2.2.3.A | 0RL0 | S | High | 3.5 | Wave, Selective | — |
| EF350 Bio | 2.2.3.A | 0RL0 | S | High | 3.5 | Wave, Selective | Y |
| WF130 | 2.1.3.A | 0RL0 | S | Free | 3.0 | Wave, Selective | Y |
| WF131 | 2.1.3.A | 0RL0 | S | Free | 2.6 | Wave, Selective | Y |
| WF300F | 2.1.3.A | 0RM0 | F | Free | 4.4 | Wave | Y |
| WF300S | 2.1.3.A | 0RM0 | S | Free | 4.4 | Wave | Y |
| AK-1 Bio | 2.2.3.A | 0RL0 | S, D | High | 5.0 | Dipping | — |
| SF1000 Bio | 2.2.3.A | 0RL0 | S | High | 2.5 | Selective, Wave | Y |
| 500-6B | 1.1.3.A | R0L0 | S, F, D, B | High | 6.0 | Wave, Selective | — |
| 500-17-1 | 1.1.3.A | R0L0 | S, F, D, B | High | 15.0 | Dipping | — |
| 500-3431BF | 2.2.3.A | 0RM0 | S | High | 4.4 | Wave | — |
| 900-7-1H | 2.1.2.A | 0RM1 | S | High | 1.7 | Dipping | — |
| HW139 | 2.2.3.A | 0RM0 | S | Medium | 2.5 | Wave, Selective | — |
| HW240 | 2.2.3.A | 0RL0 | S, F | Medium | 2.4 | Wave, Selective | — |
| L2 | 2.2.3.A | 0RL0 | S, F | High | 2.0 | Wave, Selective | — |
| P770 | 2.2.3.A | 0RL0 | S, F | High | 2.3 | Wave, Selective | — |
| P981 | 2.2.3.A | 0RL0 | S, F | High | 2.7 | Wave, Selective | — |
*Application methods: S spraying/F foaming/D dipping/B brushing
Fluxes are used in soft soldering to remove oxides and other impurities from components and PCBs. Only then can a reliable solder joint can be achieved.
Stannol offers a wide array of fluxes such as:
For any more queries you can send us a message or explore the FAQs
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In wave soldering, PCBs are soldered by passing them through a wave of solder. But whereas in reflow soldering, hot air is used to solder the electronic components on the board.
Wave soldering is ideal for soldering THT (Through Hole Technology) assembly. Besides, the process is affordable and can solder bulk PCBs in a short time. Hence, it is preferable for commercial soldering.
Wave soldering is not suitable for soldering surface-mounted components. Besides, other soldering techniques such as reflow soldering are preferred over the wave soldering technique. Hence, its use has decreased considerably in recent years.
When the temperature of the board increases suddenly, it will go into a thermal shock leading to its failure. To prevent this, the board undergoes a preheating process that raises its temperature gradually. Also most of thee fluxes get active at elevated temperatures hence preheating is important.
Yes, Drive Technologies is partnership company formed in Pune and have our corporate office in Pune, Maharashtra. Its operations are spread out all over India and EMIEA region.
